Invention Grant
US08766324B2 Power line layout techniques for integrated circuits having modular cells
有权
具有模块化单元的集成电路的电源线布局技术
- Patent Title: Power line layout techniques for integrated circuits having modular cells
- Patent Title (中): 具有模块化单元的集成电路的电源线布局技术
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Application No.: US13492469Application Date: 2012-06-08
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Publication No.: US08766324B2Publication Date: 2014-07-01
- Inventor: Cheng Hung Lee
- Applicant: Cheng Hung Lee
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L27/10
- IPC: H01L27/10

Abstract:
An integrated circuit (IC) chip includes a first memory cell array block having a first metal layer containing at least two power lines, and a second memory cell array block containing at least two power lines independent of each other, wherein all the power lines on the first metal layer serving the first memory cell array block do not extend into the second memory cell array block, and all the power lines on the first metal layer serving the second memory cell array block do not extend into the first memory cell array block.
Public/Granted literature
- US20120243363A1 POWER LINE LAYOUT TECHNIQUES FOR INTEGRATED CIRCUITS HAVING MODULAR CELLS Public/Granted day:2012-09-27
Information query
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