Invention Grant
US08766348B2 Semiconductor device with selectively located air gaps and method of fabrication
失效
具有选择性定位的气隙的半导体器件和制造方法
- Patent Title: Semiconductor device with selectively located air gaps and method of fabrication
- Patent Title (中): 具有选择性定位的气隙的半导体器件和制造方法
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Application No.: US13333710Application Date: 2011-12-21
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Publication No.: US08766348B2Publication Date: 2014-07-01
- Inventor: Tae-Kyung Kim , Woosung Choi
- Applicant: Tae-Kyung Kim , Woosung Choi
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234

Abstract:
A non-volatile semiconductor memory device comprises a semiconductor substrate and a plurality of gate structures formed on a cell region of the semiconductor substrate. The plurality of gate structures include a first select-gate and a second select-gate disposed on the cell region, the first select-gate and the second select-gate spaced apart from each other. A plurality of cell gate structures are disposed between the first select-gate and the second select-gate. The first select-gate and an adjacent cell gate structure have no air gap defined therebetween. At least a pair of adjacent cell gate structures have an air gap defined therebetween.
Public/Granted literature
- US20130161716A1 SEMICONDUCTOR DEVICE WITH SELECTIVELY LOCATED AIR GAPS AND METHOD OF FABRICATION Public/Granted day:2013-06-27
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