Invention Grant
- Patent Title: Circuit-protection devices
- Patent Title (中): 电路保护装置
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Application No.: US13400678Application Date: 2012-02-21
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Publication No.: US08766365B2Publication Date: 2014-07-01
- Inventor: Mike Smith
- Applicant: Mike Smith
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/62
- IPC: H01L23/62
Abstract:
In an embodiment, a circuit-protection device has first and second circuit-protection units, each comprising first and second nodes. A gate is between the first nodes of first and second circuit-protection units. The first nodes of first and second circuit-protection units are on a common active region.
Public/Granted literature
- US20130214359A1 CIRCUIT-PROTECTION DEVICES Public/Granted day:2013-08-22
Information query
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