Invention Grant
- Patent Title: Single metal dual dielectric CMOS device
- Patent Title (中): 单金属双介质CMOS器件
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Application No.: US12645905Application Date: 2009-12-23
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Publication No.: US08766370B2Publication Date: 2014-07-01
- Inventor: Jacob Christopher Hooker , Raghunath Singanamalla , Jasmine Petry
- Applicant: Jacob Christopher Hooker , Raghunath Singanamalla , Jasmine Petry
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate having a first region and a second region, a pMOS transistor formed over the first region and an nMOS formed over the second region. The pMOS transistor has a gate structure that includes: an interfacial layer formed over the substrate; a AlOx layer formed over the interfacial layer; and a metal layer including Mo or W formed over the AlOx layer. The nMOS transistor has a gate structure that includes: the interfacial layer formed over the substrate; a DyOx layer formed over the interfacial layer; and the metal layer including Mo or W formed over the DyOx layer.
Public/Granted literature
- US20110095376A1 SINGLE METAL DUAL DIELECTRIC CMOS DEVICE Public/Granted day:2011-04-28
Information query
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