Invention Grant
- Patent Title: Electronic device containing passive components and fabrication method thereof
- Patent Title (中): 含有无源元件的电子器件及其制造方法
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Application No.: US12843869Application Date: 2010-07-26
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Publication No.: US08766400B2Publication Date: 2014-07-01
- Inventor: Ching-Yu Ni
- Applicant: Ching-Yu Ni
- Agency: Liu & Liu
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An electronic device and fabrication method thereof are provided. The electronic device contains a glass substrate, a patterned semiconductor substrate, having at least one opening, disposed on the glass substrate and at least one passive component having a first conductive layer and a second conductive layer, wherein the first conductive layer is disposed between the patterned semiconductor substrate and the glass substrate.
Public/Granted literature
- US20110042783A1 ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2011-02-24
Information query
IPC分类:
