Invention Grant
US08766428B2 Integrated circuit packaging system with flip chip and method of manufacture thereof
有权
具有倒装芯片的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with flip chip and method of manufacture thereof
- Patent Title (中): 具有倒装芯片的集成电路封装系统及其制造方法
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Application No.: US12629879Application Date: 2009-12-02
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Publication No.: US08766428B2Publication Date: 2014-07-01
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/06 ; H01L23/02 ; H01L23/22 ; H01L23/24
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.
Public/Granted literature
- US20110127661A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-06-02
Information query
IPC分类:
