Invention Grant
- Patent Title: Integrated circuit package including embedded thin-film battery
- Patent Title (中): 集成电路封装，包括嵌入式薄膜电池
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Application No.: US10880757Application Date: 2004-06-30
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Publication No.: US08766435B2Publication Date: 2014-07-01
- Inventor: Michael J. Hundt , Haibin Du , Krishnan Kelappan , Frank Sigmund
- Applicant: Michael J. Hundt , Haibin Du , Krishnan Kelappan , Frank Sigmund
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Munck Wilson Mandala, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/58 ; H01M6/18 ; H01M2/10 ; H01M6/40
Abstract:
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
Public/Granted literature
- US20060001137A1 Integrated circuit package including embedded thin-film battery Public/Granted day:2006-01-05
Information query
IPC分类:
