Invention Grant
- Patent Title: Moisture barrier for a wire bond
- Patent Title (中): 导线键合的水分屏障
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Application No.: US13037836Application Date: 2011-03-01
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Publication No.: US08766436B2Publication Date: 2014-07-01
- Inventor: John M. DeLucca , Frank A. Baiocchi , Ronald J. Weachock , John W. Osenbach , Barry J. Dutt
- Applicant: John M. DeLucca , Frank A. Baiocchi , Ronald J. Weachock , John W. Osenbach , Barry J. Dutt
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Main IPC: H01L23/485
- IPC: H01L23/485
Abstract:
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
Public/Granted literature
- US20120223432A1 MOISTURE BARRIER FOR A WIRE BOND Public/Granted day:2012-09-06
Information query
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