Invention Grant
US08766443B2 Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
有权
各向异性导电膜组合物，各向异性导电膜和与其结合的半导体器件
- Patent Title: Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
- Patent Title (中): 各向异性导电膜组合物，各向异性导电膜和与其结合的半导体器件
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Application No.: US13710728Application Date: 2012-12-11
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Publication No.: US08766443B2Publication Date: 2014-07-01
- Inventor: Arum Yu , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Hyun Min Choi
- Applicant: Arum Yu , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Hyun Min Choi
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0134685 20111214
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.
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