Invention Grant
US08766452B2 Semiconductor device including conductive lines and pads 有权
半导体器件包括导线和焊盘

  • Patent Title: Semiconductor device including conductive lines and pads
  • Patent Title (中): 半导体器件包括导线和焊盘
  • Application No.: US13593992
    Application Date: 2012-08-24
  • Publication No.: US08766452B2
    Publication Date: 2014-07-01
  • Inventor: Dae Sung Eom
  • Applicant: Dae Sung Eom
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2011-0085084 20110825
  • Main IPC: H01L23/48
  • IPC: H01L23/48 H01L21/768
Semiconductor device including conductive lines and pads
Abstract:
A semiconductor device having a conductive pattern includes a plurality of conductive lines extending in parallel, each having a first region extending in a first direction and a second region coupled to the first region and extending in a second direction crossing the first direction, and a plurality of contact pads, each coupled to a respective conductive line of the second regions, wherein the conductive lines are grouped and arranged in a plurality of groups, the first region of a first group is longer than the first region of a second group, and the second region of the first group and the second region of the second group are spaced apart from each other.
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