Invention Grant
- Patent Title: Semiconductor device including conductive lines and pads
- Patent Title (中): 半导体器件包括导线和焊盘
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Application No.: US13593992Application Date: 2012-08-24
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Publication No.: US08766452B2Publication Date: 2014-07-01
- Inventor: Dae Sung Eom
- Applicant: Dae Sung Eom
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2011-0085084 20110825
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768

Abstract:
A semiconductor device having a conductive pattern includes a plurality of conductive lines extending in parallel, each having a first region extending in a first direction and a second region coupled to the first region and extending in a second direction crossing the first direction, and a plurality of contact pads, each coupled to a respective conductive line of the second regions, wherein the conductive lines are grouped and arranged in a plurality of groups, the first region of a first group is longer than the first region of a second group, and the second region of the first group and the second region of the second group are spaced apart from each other.
Public/Granted literature
- US20130049211A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-02-28
Information query
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