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US08766457B2 Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package 有权
半导体封装的结合结构，其制造方法和堆叠型半导体封装

  • Patent Title: Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
  • Patent Title (中): 半导体封装的结合结构，其制造方法和堆叠型半导体封装
  • Application No.: US13305985
    Application Date: 2011-11-29
  • Publication No.: US08766457B2
    Publication Date: 2014-07-01
  • Inventor: Seong Cheol Kim
  • Applicant: Seong Cheol Kim
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: William Park & Associates Patent Ltd.
  • Priority: KR10-2010-0121245 20101201; KR10-2011-0123017 20111123
  • Main IPC: H01L29/40
  • IPC: H01L29/40
Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
Abstract:
A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.
Abstract(Chinese):

半导体封装的接合结构包括：第一导电构件，被配置为传输电信号; 以及焊盘，其被配置为电耦合到所述第一导电构件的表面并且包括多个子接合焊盘。

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