Invention Grant
- Patent Title: Integrated circuit device and electronic apparatus
- Patent Title (中): 集成电路器件和电子设备
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Application No.: US12730313Application Date: 2010-03-24
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Publication No.: US08766464B2Publication Date: 2014-07-01
- Inventor: Hideki Ogawa
- Applicant: Hideki Ogawa
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2009-175012 20090728
- Main IPC: H01L29/40
- IPC: H01L29/40

Abstract:
An integrated circuit device includes a first pad group connected to a first memory pad group arranged along a first chip side of a chip of an image memory stacked on the integrated circuit device, a second pad group connected to a second memory pad group arranged along a third chip side, a control section which controls display of an electro-optical device, and a third pad group from which a data signal and a control signal for display control. The first pad group is arranged along a first side of the integrated circuit device, wherein the second pad group is arranged along a third side facing the first side, and wherein the third pad group is arranged along a second side which intersects with the first side and the third side.
Public/Granted literature
- US20110025699A1 INTEGRATED CIRCUIT DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2011-02-03
Information query
IPC分类: