Invention Grant
- Patent Title: Microstrip line structures with alternating wide and narrow portions having different thicknesses relative to ground, method of manufacture and design structures
- Patent Title (中): 具有相对于地面具有不同厚度的交替宽和窄部分的微带线结构，制造方法和设计结构
-
Application No.: US12960009Application Date: 2010-12-03
-
Publication No.: US08766748B2Publication Date: 2014-07-01
- Inventor: Essam Mina , Guoan Wang , Wayne H. Woods, Jr.
- Applicant: Essam Mina , Guoan Wang , Wayne H. Woods, Jr.
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P9/00
Abstract:
On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground.
Public/Granted literature
Information query
