Invention Grant
- Patent Title: Housing combination of electronic device and method
- Patent Title (中): 电子装置和方法的住房组合
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Application No.: US13220873Application Date: 2011-08-30
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Publication No.: US08766860B2Publication Date: 2014-07-01
- Inventor: Qi-Yuan Li , Yong Yan , Yong-Fa Fan , Xue-Li Zhang , Zhao-Yi Wu , Li Liu
- Applicant: Qi-Yuan Li , Yong Yan , Yong-Fa Fan , Xue-Li Zhang , Zhao-Yi Wu , Li Liu
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110080079 20110331
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/40
Abstract:
A housing combination includes a housing, and at least two antenna modules embedded at corners of the housing. Each antenna module includes an antenna carrier and an antenna radiator. The antenna carrier defines a first receiving groove and a second receiving groove opposite to each other. The antenna radiator includes a main portion and a conductive contact. The main portion is received in the first receiving groove, and the conductive contact is received in the second receiving groove. The main portion is embedded in the housing, and the conductive contact is exposed from the housing.
Public/Granted literature
- US20120249378A1 HOUSING COMBINATION OF ELECTRONIC DEVICE AND METHOD Public/Granted day:2012-10-04
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