Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US13165335Application Date: 2011-06-21
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Publication No.: US08767140B2Publication Date: 2014-07-01
- Inventor: Yongxin He
- Applicant: Yongxin He
- Applicant Address: CN Beijing CN Hefei, Anhui Province
- Assignee: Boe Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee: Boe Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Hefei, Anhui Province
- Agency: Ladas & Parry LLP
- Priority: CN201020246454U 20100622
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; F21V7/04

Abstract:
An embodiment of the invention provides a backlight module, comprising: a metal rear plate, comprising a bottom plate, a side edge structure and a bended structure; a light strip structure including a circuit substrate and a light source disposed on the circuit substrate; and an outer frame, wherein, the bended structure is provided with a first protruding structure extending toward the light strip structure, the bottom plate is provided with a second protruding structure extending toward the light strip structure, the circuit substrate of the light strip structure is fixed on the side edge structure by the first and second protruding structures, the side edge structure is provided with a first opening aligned with to the light source, the outer frame is provided with a second opening corresponding to the first opening.
Public/Granted literature
- US20110310327A1 BACKLIGHT MODULE Public/Granted day:2011-12-22
Information query
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