Invention Grant
- Patent Title: Ambient temperature ball bond
- Patent Title (中): 环境温度球焊
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Application No.: US13755175Application Date: 2013-01-31
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Publication No.: US08767351B1Publication Date: 2014-07-01
- Inventor: Leping Li , Saravuth Keo , Kara L. Maytag , Pramit P. Parikh , Jeff R. O'Konski , Mark A. Herendeen , Joel W. Hoehn , Roger L. Hipwell , Joe J. Schobel , John L. Ibele , Ralph Marquart , Edward Knutson
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: HolzerIPLaw, PC
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.
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