Invention Grant
- Patent Title: Electrically conductive paste composition
- Patent Title (中): 导电胶组合物
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Application No.: US13667563Application Date: 2012-11-02
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Publication No.: US08767378B2Publication Date: 2014-07-01
- Inventor: Toshiaki Ogiwara
- Applicant: E I du Pont de Nemours and Company
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 μm and no more than 5 μm and flake-shaped silver powders having a mean particle size of no more than 10 μm; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.
Public/Granted literature
- US20140126113A1 ELECTRICALLY CONDUCTIVE PASTE COMPOSITION Public/Granted day:2014-05-08
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