Invention Grant
- Patent Title: Chassis with adjustable baffle for cooling
- Patent Title (中): 底盘带可调节挡板进行冷却
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Application No.: US13595777Application Date: 2012-08-27
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Publication No.: US08767391B2Publication Date: 2014-07-01
- Inventor: Youlin Jin , Jiye Xu , Vadim Gektin
- Applicant: Youlin Jin , Jiye Xu , Vadim Gektin
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; A47B77/08 ; H05K5/00

Abstract:
A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.
Public/Granted literature
- US20140055951A1 Chassis with Adjustable Baffle for Cooling Public/Granted day:2014-02-27
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