Invention Grant
- Patent Title: Decoupling capacitor circuitry
- Patent Title (中): 去耦电容电路
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Application No.: US13175724Application Date: 2011-07-01
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Publication No.: US08767404B2Publication Date: 2014-07-01
- Inventor: Chin Hieang Khor
- Applicant: Chin Hieang Khor
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Treyz Law Group
- Agent Chih-Yun Wu
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
Integrated circuits with decoupling capacitor circuitry are provided. The decoupling capacitor circuitry may include density-compliance structures. The density-compliance structures may be strapped to metal paths driven by power supply lines. Strapping density-compliance dummy structures in this way may increase the capacitance per unit area of the decoupling capacitor circuitry. Strapping density-compliance dummy structures in this way may shield the decoupling capacitor from nearby noisy signal sources.
Public/Granted literature
- US20130001664A1 DECOUPLING CAPACITOR CIRCUITRY Public/Granted day:2013-01-03
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