A coupled analysis simulation apparatus includes a coupled analysis processing unit configured to perform coupled analysis by performing electromagnetic field analysis and circuit analysis in coordination with each other, the electromagnetic field analysis being performed on a space including conductive layers to which an electronic circuit module is connected, the circuit analysis being performed on the electronic circuit module; a first generating unit configured to generate a virtual conductive part in a section or a region including connection parts connecting the electronic circuit module with the conductive layers; and a second generating unit configured to generate virtual connection parts that virtually connect the virtual conductive part with the conductive layers at positions where the connection parts are connected to the conductive layers.