Invention Grant
- Patent Title: Method of making conductive pattern
- Patent Title (中): 制作导电图案的方法
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Application No.: US12842103Application Date: 2010-07-23
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Publication No.: US08769805B2Publication Date: 2014-07-08
- Inventor: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- Applicant: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- Main IPC: H01P11/00
- IPC: H01P11/00 ; H01Q13/00

Abstract:
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
Public/Granted literature
- US20100283615A1 Conductive Pattern and Method of Making Public/Granted day:2010-11-11
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