Invention Grant
- Patent Title: Part mounting method
- Patent Title (中): 零件安装方法
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Application No.: US12699958Application Date: 2010-02-04
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Publication No.: US08769810B2Publication Date: 2014-07-08
- Inventor: Toru Nishino , Kazuyuki Ikura
- Applicant: Toru Nishino , Kazuyuki Ikura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K13/00 ; H05K13/04 ; H05K13/08 ; H01L21/70 ; H01L21/82 ; H01L23/00 ; H01L25/00
Abstract:
A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.
Public/Granted literature
- US20100132187A1 PART MOUNTING APPARATUS AND METHOD Public/Granted day:2010-06-03
Information query
