Invention Grant
- Patent Title: Method of manufacturing a wiring material
- Patent Title (中): 制造布线材料的方法
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Application No.: US12842671Application Date: 2010-07-23
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Publication No.: US08769813B2Publication Date: 2014-07-08
- Inventor: Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
- Applicant: Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2004-358648 20041210; JP2005-355237 20051208
- Main IPC: H01R43/04
- IPC: H01R43/04

Abstract:
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
Public/Granted literature
- US20100281686A1 METHOD OF MANUFACTURING A WIRING MATERIAL Public/Granted day:2010-11-11
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