Invention Grant
- Patent Title: Sensor assembly and sensor module
- Patent Title (中): 传感器组件和传感器模块
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Application No.: US13401300Application Date: 2012-02-21
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Publication No.: US08770045B2Publication Date: 2014-07-08
- Inventor: Masaru Murayama , Yuuki Saitou , Tomonori Hayakawa , Kazunobu Hashimoto
- Applicant: Masaru Murayama , Yuuki Saitou , Tomonori Hayakawa , Kazunobu Hashimoto
- Applicant Address: JP Aichi-Ken
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Aichi-Ken
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2009-222119 20090928
- Main IPC: G01L1/00
- IPC: G01L1/00

Abstract:
A purpose is to provide a sensor assembly and a sensor module having a flexible sensor element that uses polymer material and having a component such as the sensor element and the like that hardly deteriorates and is superior in durability. A sensor assembly includes a sensor element and an exterior packaging bag enclosing the sensor element. The sensor element includes a sensor thin film made of resin or elastomer, and at least one pair of electrodes connected to the sensor thin film. The exterior packaging bag is made from laminate films having a metal foil and two resin layers arranged sandwiching the metal foil.
Public/Granted literature
- US20120144935A1 SENSOR ASSEMBLY AND SENSOR MODULE Public/Granted day:2012-06-14
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