Invention Grant
- Patent Title: Pallet assembly
- Patent Title (中): 托盘组装
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Application No.: US13767855Application Date: 2013-02-14
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Publication No.: US08770115B2Publication Date: 2014-07-08
- Inventor: William P. Apps , Sean T. Ogburn
- Applicant: Rehrig Pacific Company
- Applicant Address: US CA Los Angeles
- Assignee: Rehrig Pacific Company
- Current Assignee: Rehrig Pacific Company
- Current Assignee Address: US CA Los Angeles
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: B65D19/12
- IPC: B65D19/12

Abstract:
A pallet assembly includes an upper portion and a lower portion. The upper portion includes an upper deck for supporting items thereon and upper column portions extending downward from the upper deck. The upper column portions include a first upper column portion having a slot defined by a pair of slot walls. The lower portion includes a plurality of lower column portions including a first lower column portion. The first lower column portion includes a peripheral wall and a support structure having a pair of walls extending inward from the peripheral wall. One of the first upper column portion and the first lower column portion is received within the other, with the support structure received in the slot between the slot walls.
Public/Granted literature
- US20130220184A1 PALLET ASSEMBLY Public/Granted day:2013-08-29
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