Invention Grant
- Patent Title: Wet type friction plate
- Patent Title (中): 湿式摩擦片
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Application No.: US12678407Application Date: 2008-09-11
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Publication No.: US08770368B2Publication Date: 2014-07-08
- Inventor: Tetsu Hiroshima
- Applicant: Tetsu Hiroshima
- Applicant Address: JP Yamanashi
- Assignee: Kito Corporation
- Current Assignee: Kito Corporation
- Current Assignee Address: JP Yamanashi
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-248140 20070925
- International Application: PCT/JP2008/066466 WO 20080911
- International Announcement: WO2009/041284 WO 20090402
- Main IPC: F16D13/64
- IPC: F16D13/64
Abstract:
A wet friction plate is constructed such that a carbon based friction material is placed on an outer peripheral side of a friction plate and a paper based friction material is placed on an inside of a carbon based friction material. A transmission torque occupied by the paper based friction material is smaller than that occupied by the carbon based friction material. The wet friction plate can prevent a sudden unexpected slip at low temperature.
Public/Granted literature
- US20100206683A1 WET TYPE FRICTION PLATE Public/Granted day:2010-08-19
Information query
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