Invention Grant
- Patent Title: Supporting structure for electronic device
- Patent Title (中): 电子设备配套结构
-
Application No.: US13362054Application Date: 2012-01-31
-
Publication No.: US08770538B2Publication Date: 2014-07-08
- Inventor: An Szu Hsu , Chien Cheng Mai , Way Han Dai
- Applicant: An Szu Hsu , Chien Cheng Mai , Way Han Dai
- Applicant Address: TW New Taipei
- Assignee: First Dome Corporation
- Current Assignee: First Dome Corporation
- Current Assignee Address: TW New Taipei
- Agency: Rosenberg, Klein & Lee
- Main IPC: A47G29/00
- IPC: A47G29/00 ; F16M11/00

Abstract:
A supporting structure for an electronic device is provided to reduce the thickness or volume of device structures in conventional skills. The supporting structure includes a connecting arm having a first end and a second end which are substantially pivoted to a side region of a sliding and/or rotating module and an edge portion of a substrate module, respectively. With the connecting arm being rotated in response to the movement of the sliding and/or rotating module, the rotation or combination type can be provided between the first and second ends of the connecting arm and the side regions of the sliding and/or rotating module and the edge portion of the substrate module, thereby improving difficulties of the internal structure and design of the assembly of conventional supporting structure and electronic device.
Public/Granted literature
- US20130193292A1 SUPPORTING STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2013-08-01
Information query