Invention Grant
- Patent Title: Element substrate and printed wiring board
- Patent Title (中): 元件基板和印刷线路板
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Application No.: US13855531Application Date: 2013-04-02
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Publication No.: US08770690B2Publication Date: 2014-07-08
- Inventor: Kengo Umeda
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc., IP Division
- Priority: JP2010-112291 20100514
- Main IPC: H03K17/16
- IPC: H03K17/16

Abstract:
An element substrate includes a plurality of terminals, a first receiving circuit and a second receiving circuit each receiving a differential signal via one of the terminals included in the plurality of terminals, a driving circuit including a first input unit for inputting a first signal and a second input unit for inputting a second signal and driving a driving element based on the first signal and the second signal, and a setting circuit for setting a first connection state of connecting an output from the first receiving circuit to the first input unit and connecting an output from the second receiving circuit to the second input unit, and a second connection state of connecting an output from the first receiving circuit to the second input unit and connecting an output from the second receiving circuit to the first input unit based on an externally input signal.
Public/Granted literature
- US20130222451A1 ELEMENT SUBSTRATE AND PRINTED WIRING BOARD Public/Granted day:2013-08-29
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