Invention Grant
US08770988B2 Connector 有权
连接器

  • Patent Title: Connector
  • Patent Title (中): 连接器
  • Application No.: US13498236
    Application Date: 2010-10-05
  • Publication No.: US08770988B2
    Publication Date: 2014-07-08
  • Inventor: Koji Furukawa
  • Applicant: Koji Furukawa
  • Applicant Address: JP Tokyo
  • Assignee: Yazaki Corporation
  • Current Assignee: Yazaki Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2009-231829 20091005; JP2010-201792 20100909
  • International Application: PCT/JP2010/067819 WO 20101005
  • International Announcement: WO2011/043488 WO 20110414
  • Main IPC: H01R12/00
  • IPC: H01R12/00
Connector
Abstract:
To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost.A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4. In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2. The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5. Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5.
Public/Granted literature
Information query
Patent Agency Ranking
0/0