Invention Grant
- Patent Title: Connector
- Patent Title (中): 连接器
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Application No.: US13498236Application Date: 2010-10-05
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Publication No.: US08770988B2Publication Date: 2014-07-08
- Inventor: Koji Furukawa
- Applicant: Koji Furukawa
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-231829 20091005; JP2010-201792 20100909
- International Application: PCT/JP2010/067819 WO 20101005
- International Announcement: WO2011/043488 WO 20110414
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost.A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4. In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2. The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5. Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5.
Public/Granted literature
- US20120184142A1 CONNECTOR Public/Granted day:2012-07-19
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