Invention Grant
- Patent Title: Lead frame assembly for an electrical connector
- Patent Title (中): 电连接器的引线框组件
-
Application No.: US12998233Application Date: 2008-09-30
-
Publication No.: US08771023B2Publication Date: 2014-07-08
- Inventor: Jeroen De Bruijn
- Applicant: Jeroen De Bruijn
- Applicant Address: FR Guyancourt
- Assignee: FCI
- Current Assignee: FCI
- Current Assignee Address: FR Guyancourt
- Agency: Harrington & Smith
- International Application: PCT/IB2008/055634 WO 20080930
- International Announcement: WO2010/038110 WO 20100408
- Main IPC: H01R13/514
- IPC: H01R13/514

Abstract:
A lead frame assembly for an electrical connector is provided. The lead frame assembly includes a first lead, a second lead adjacent the first lead and a dielectric material. The leads have a first end, a second end and an intermediate portion between the first end and the second end. The leads are received within the dielectric material with the intermediate portions being substantially surrounded by the dielectric material. The dielectric material includes at least a first channel in the dielectric material arranged in-between the first and second leads. The first channel is defined by at least three sides and has a length extending in a direction substantially parallel to the intermediate portions of the first and second leads.
Public/Granted literature
- US20110195607A1 LEAD FRAME ASSEMBLY FOR AN ELECTRICAL CONNECTOR Public/Granted day:2011-08-11
Information query