Invention Grant
- Patent Title: Interspinous process implant and method of implantation
- Patent Title (中): 椎间植入植入和植入方法
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Application No.: US12607917Application Date: 2009-10-28
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Publication No.: US08771317B2Publication Date: 2014-07-08
- Inventor: Mingyan Liu , Jeffrey Zhang , Loic Josse
- Applicant: Mingyan Liu , Jeffrey Zhang , Loic Josse
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61B17/70
- IPC: A61B17/70
Abstract:
Medical devices for the treatment of spinal conditions are described herein. The medical device of this invention includes a spacer that is disposed between adjacent spinous processes and has a proximal retention member and a distal retention member, which may be rotated with respect to the proximal retention member between an initial implantation configuration and a final locked configuration.
Public/Granted literature
- US20110098745A1 INTERSPINOUS PROCESS IMPLANT AND METHOD OF IMPLANTATION Public/Granted day:2011-04-28
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