Invention Grant
US08771389B2 Methods of making and attaching TSP material for forming cutting elements, cutting elements having such TSP material and bits incorporating such cutting elements
失效
制造和附接用于形成切割元件的TSP材料，具有这种TSP材料的切割元件和包含这种切割元件的钻头的方法
- Patent Title: Methods of making and attaching TSP material for forming cutting elements, cutting elements having such TSP material and bits incorporating such cutting elements
- Patent Title (中): 制造和附接用于形成切割元件的TSP材料，具有这种TSP材料的切割元件和包含这种切割元件的钻头的方法
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Application No.: US12775420Application Date: 2010-05-06
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Publication No.: US08771389B2Publication Date: 2014-07-08
- Inventor: Madapusi K. Keshavan , Monte Russell
- Applicant: Madapusi K. Keshavan , Monte Russell
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc.
- Current Assignee: Smith International, Inc.
- Current Assignee Address: US TX Houston
- Agency: Christie, Parker & Hale, LLP
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24D11/00
Abstract:
A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.
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