Invention Grant
- Patent Title: Low sloped edge ring for plasma processing chamber
- Patent Title (中): 用于等离子体处理室的低倾斜边缘环
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Application No.: US13649196Application Date: 2012-10-11
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Publication No.: US08771423B2Publication Date: 2014-07-08
- Inventor: Changhun Lee , Michael D. Willwerth , Hoan Nguyen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
Embodiments of a cover ring for use in a plasma processing chamber are provided. In one embodiment, a cover ring for use in a plasma processing chamber includes a ring-shaped body fabricated from a yttrium (Y) containing material. The body includes a bottom surface having an inner locating ring and an outer locating ring. The inner locating ring extends further from the body than the outer locating ring. The body includes an inner diameter wall having a main wall and a secondary wall separated by a substantially horizontal land. The body also includes a top surface having an outer sloped top surface meeting an inner sloped surface at an apex. The inner sloped surface defines an angle with a line perpendicular to a centerline of the body less than about 70 degrees.
Public/Granted literature
- US20130032478A1 LOW SLOPED EDGE RING FOR PLASMA PROCESSING CHAMBER Public/Granted day:2013-02-07
Information query
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