Invention Grant
- Patent Title: Method for drying a substrate
- Patent Title (中): 干燥基材的方法
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Application No.: US14028571Application Date: 2013-09-17
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Publication No.: US08771430B2Publication Date: 2014-07-08
- Inventor: Kae Jeng Ng , Kien Hui Liang , Kien Yew Liang
- Applicant: Invenpro (M) SDN. BHD.
- Applicant Address: MY Selangor, Darul Ehsan
- Assignee: Invenpro (M) SDN. BHD.
- Current Assignee: Invenpro (M) SDN. BHD.
- Current Assignee Address: MY Selangor, Darul Ehsan
- Agency: Sughrue Mion, PLLC
- Priority: MYPI20064470 20061109
- Main IPC: B08B1/02
- IPC: B08B1/02

Abstract:
A method for drying a workpiece using an apparatus comprising a liquid bath for immersing said workpiece, a deionized water supply for supplying deionized water to said bath, a partially enclosed volume of heated inert gas located above said liquid bath and a heated inert gas supply for supplying heated inert gas. A first holder is used for holding said workpiece in said liquid bath with a vertical orientation between the first holder and said liquid bath and a second holder, comprising a horizontal member, that is able to hold said at least one workpiece in such a way as to substantially prevent said workpiece from sliding along said horizontal member.
Public/Granted literature
- US20140014135A1 METHOD FOR DRYING A SUBSTRATE Public/Granted day:2014-01-16
Information query
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