Invention Grant
- Patent Title: Fill pack assembly and method with bonded sheet pairs
- Patent Title (中): 填充组件和方法与粘合片对
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Application No.: US12340324Application Date: 2008-12-19
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Publication No.: US08771457B2Publication Date: 2014-07-08
- Inventor: Eldon F. Mockry , Ohler L. Kinney, Jr. , Kenneth P. Mortensen , Glenn S. Brenneke
- Applicant: Eldon F. Mockry , Ohler L. Kinney, Jr. , Kenneth P. Mortensen , Glenn S. Brenneke
- Applicant Address: US KS Overland Park
- Assignee: SPX Cooling Technologies, Inc.
- Current Assignee: SPX Cooling Technologies, Inc.
- Current Assignee Address: US KS Overland Park
- Agency: Baker & Hostetler LLP
- Main IPC: B29C65/14
- IPC: B29C65/14
Abstract:
A fill pack assembly and method for assembling a fill pack from individual sheets utilizes integrally bonded sheet pairs. Each sheet pair is a pair of two individual adjacent fill sheets which have been bonded together via any suitable bonding method. A plurality of the thus formed sheet pairs can then be attached together to form an entire fill pack or portion of a fill pack. Such fill packs are useful in heat exchange devices such as industrial cooling towers.
Public/Granted literature
- US20100159209A1 FILL PACK ASSEMBLY AND METHOD WITH BONDED SHEET PAIRS Public/Granted day:2010-06-24
Information query
