Invention Grant
- Patent Title: Manufacturing techniques for workpieces with varying topographies
- Patent Title (中): 具有不同形貌的工件的制造技术
-
Application No.: US13350010Application Date: 2012-01-13
-
Publication No.: US08771534B2Publication Date: 2014-07-08
- Inventor: Chun-Chang Chen , Shih-Chi Fu , Wang-Pen Mo , Hung-Chang Hsieh
- Applicant: Chun-Chang Chen , Shih-Chi Fu , Wang-Pen Mo , Hung-Chang Hsieh
- Applicant Address: TW Hsin-chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
Some embodiments relate to a method for processing a workpiece. In the method, an anti-reflective coating layer is provided over the workpiece. A first patterned photoresist layer, which has a first photoresist tone, is provided over the anti-reflective coating layer. A second patterned photoresist layer, which has a second photoresist tone opposite the first photoresist tone, is provided over the first patterned photoresist layer. An opening extends through the first and second patterned photoresist layers to allow a treatment to be applied to the workpiece through the opening. Other embodiments are also disclosed.
Public/Granted literature
- US20130181320A1 Manufacturing Techniques for Workpieces with Varying Topographies Public/Granted day:2013-07-18
Information query