Invention Grant
- Patent Title: Sample contamination method
- Patent Title (中): 样品污染方法
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Application No.: US13188719Application Date: 2011-07-22
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Publication No.: US08771535B2Publication Date: 2014-07-08
- Inventor: Yuji Yamada , Makiko Katano , Ayako Mizuno , Eri Uemura , Asuka Uchinuno , Chikashi Takeuchi
- Applicant: Yuji Yamada , Makiko Katano , Ayako Mizuno , Eri Uemura , Asuka Uchinuno , Chikashi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2010-275338 20101210
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N1/28
Abstract:
A sample contamination method according to an embodiment includes spraying a chemical solution containing contaminants into a casing, carrying a semiconductor substrate into the casing filled with the chemical solution by the spraying, leaving the semiconductor substrate in the casing filled with the chemical solution for a predetermined time, and carrying the semiconductor substrate out of the casing after the predetermined time passes.
Public/Granted literature
- US20120149199A1 SAMPLE CONTAMINATION METHOD Public/Granted day:2012-06-14
Information query
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