Invention Grant
- Patent Title: Highly dilutable polishing concentrates and slurries
- Patent Title (中): 高度可稀释的抛光浓缩液和浆液
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Application No.: US13848484Application Date: 2013-03-21
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Publication No.: US08771540B2Publication Date: 2014-07-08
- Inventor: Hyungjun Kim , Richard Wen , Bin Hu , Minae Tanaka , Deepak Mahulikar
- Applicant: Fujifilm Planar Solutions, LLC
- Applicant Address: US RI North Kingstown
- Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee Address: US RI North Kingstown
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
Public/Granted literature
- US20130288478A1 HIGHLY DILUTABLE POLISHING CONCENTRATES AND SLURRIES Public/Granted day:2013-10-31
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