Invention Grant
US08771553B2 Conductive fine particle and metal paste for electrode formation, and electrode
有权
用于电极形成的导电细颗粒和金属膏,以及电极
- Patent Title: Conductive fine particle and metal paste for electrode formation, and electrode
- Patent Title (中): 用于电极形成的导电细颗粒和金属膏,以及电极
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Application No.: US13387976Application Date: 2011-07-08
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Publication No.: US08771553B2Publication Date: 2014-07-08
- Inventor: Takuya Hosoi , Nobuhisa Okamoto , Koichi Sakairi
- Applicant: Takuya Hosoi , Nobuhisa Okamoto , Koichi Sakairi
- Applicant Address: JP Tokyo
- Assignee: Tanaka Kikinzoku Kogyo K.K.
- Current Assignee: Tanaka Kikinzoku Kogyo K.K.
- Current Assignee Address: JP Tokyo
- Agency: Roberts & Roberts, LLP
- Priority: JP2010-157801 20100712
- International Application: PCT/JP2011/065673 WO 20110708
- International Announcement: WO2012/008373 WO 20120119
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01B5/00

Abstract:
An object of the present invention is to provide a conductive fine particle for producing a metal paste that can produce an electrode film having a low resistance, and a metal paste utilizing the conductive fine particle. The present invention is a conductive particle for electrode formation having a core/shell structure, and the conductive particle comprises a core particle made of Pt or a Pt alloy and having a particle diameter of 10 to 200 nm, and a shell made of a ceramic containing Al2O3 or ZrO2 and covers at least a part of the core particle, wherein the ceramic constituting the shell is added in an amount of 0.5 to 15% by weight based on the core particle to cover the core. The core particle is preferably Pt or a Pt alloy alloyed with Pd, Au, Ag, or Rh.
Public/Granted literature
- US20120126183A1 CONDUCTIVE FINE PARTICLE AND METAL PASTE FOR ELECTRODE FORMATION, AND ELECTRODE Public/Granted day:2012-05-24
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