Invention Grant
US08771554B2 Thick film silver paste containing Al2O3 and lead-tellurium—oxide and its use in the manufacture of semiconductor devices
失效
含有Al2O3和铅 - 碲氧化物的厚膜银浆及其在制造半导体器件中的应用
- Patent Title: Thick film silver paste containing Al2O3 and lead-tellurium—oxide and its use in the manufacture of semiconductor devices
- Patent Title (中): 含有Al2O3和铅 - 碲氧化物的厚膜银浆及其在制造半导体器件中的应用
-
Application No.: US13623238Application Date: 2012-09-20
-
Publication No.: US08771554B2Publication Date: 2014-07-08
- Inventor: Raj G. Rajendran
- Applicant: E I du Pont de Nemours and Company
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01L31/0224 ; H01L35/14
Abstract:
The present invention is directed to a thick film silver paste comprising (i) silver, (ii) Al2O3, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good adhesion and good electrical performance.
Public/Granted literature
Information query
