Invention Grant
- Patent Title: Offset mold twinning
- Patent Title (中): 胶版模具搭配
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Application No.: US12880498Application Date: 2010-09-13
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Publication No.: US08771568B2Publication Date: 2014-07-08
- Inventor: Lance T. Hampel
- Applicant: Lance T. Hampel
- Agency: Quarles & Brady LLP
- Main IPC: B29C51/32
- IPC: B29C51/32

Abstract:
Thermoplastic parts are made of predominantly single unit thickness but with marginal areas of increased thickness by molding two parts in a common mold having overlapping mold portions. Two thicknesses of thermoplastic material are molded together in the areas of increased thickness at opposite ends of the common mold and the parts are separated from one another by trimming such that each part has an area of increased solid wall thickness and an area of reduced thickness.
Public/Granted literature
- US20100327478A1 OFFSET MOLD TWINNING Public/Granted day:2010-12-30
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