Invention Grant
US08771803B2 Method of applying a microstructure, mould and article with a microstructure 有权
微观结构,模具和制品微结构的应用方法

  • Patent Title: Method of applying a microstructure, mould and article with a microstructure
  • Patent Title (中): 微观结构,模具和制品微结构的应用方法
  • Application No.: US12304498
    Application Date: 2007-06-13
  • Publication No.: US08771803B2
    Publication Date: 2014-07-08
  • Inventor: Marius Dichtl
  • Applicant: Marius Dichtl
  • Applicant Address: DE Munich
  • Assignee: Giesecke & Devrient GmbH
  • Current Assignee: Giesecke & Devrient GmbH
  • Current Assignee Address: DE Munich
  • Agency: Lathrop & Gage LLP
  • Priority: DE102006029852 20060627
  • International Application: PCT/EP2007/005200 WO 20070613
  • International Announcement: WO2008/000350 WO 20080103
  • Main IPC: C08J7/04
  • IPC: C08J7/04
Method of applying a microstructure, mould and article with a microstructure
Abstract:
The present invention relates to a method for applying a colored or colorless micropattern to a support, in which a) a die form (40) is prepared whose surface exhibits an arrangement of elevations (42) and depressions (44) in the form of the desired micropattern, b) the depressions (44) in the die form are filled with a curable colored or colorless lacquer (26), c) the support (20, 30) is pretreated for a good anchoring of the colored or colorless lacquer (26), d) the surface of the die form (40) is brought into contact with the support (20, 30), e) the lacquer (26) that is in contact with the support (20, 30) in the depressions in the die form (40) is cured and, in the process, joined with the support (20, 30), and f) the surface of the die form (40) is removed from the support (20, 30) again such that the cured lacquer (26) that is joined with the support (20, 30) is pulled out of the depressions (44) in the die form (40).
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