Invention Grant
- Patent Title: Sealing film and a semiconductor device using the same
- Patent Title (中): 密封膜和使用其的半导体器件
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Application No.: US12299714Application Date: 2008-01-24
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Publication No.: US08771828B2Publication Date: 2014-07-08
- Inventor: Hiroyuki Kawakami , Katsuyasu Niijima , Naoki Tomori , Daichi Takemori , Takuya Imai
- Applicant: Hiroyuki Kawakami , Katsuyasu Niijima , Naoki Tomori , Daichi Takemori , Takuya Imai
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2007-016891 20070126; JPP2007-109316 20070418
- International Application: PCT/JP2008/050978 WO 20080124
- International Announcement: WO2008/090950 WO 20080731
- Main IPC: H01L23/28
- IPC: H01L23/28 ; B32B27/38 ; B32B27/20 ; C08K3/36 ; H01L23/29 ; C08G59/62 ; C08L63/00 ; C08K3/00
Abstract:
A sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.
Public/Granted literature
- US20090189300A1 Sealing Film and a Semiconductor Device Using the Same Public/Granted day:2009-07-30
Information query
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