Invention Grant
US08771921B2 Negative resist composition, method of forming resist pattern and polymeric compound
有权
抗蚀剂组合物，抗蚀剂图案和高分子化合物的形成方法
- Patent Title: Negative resist composition, method of forming resist pattern and polymeric compound
- Patent Title (中): 抗蚀剂组合物，抗蚀剂图案和高分子化合物的形成方法
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Application No.: US13410893Application Date: 2012-03-02
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Publication No.: US08771921B2Publication Date: 2014-07-08
- Inventor: Abe Sho , Shiono Daiju , Hirano Tomoyuki , Dazai Takahiro
- Applicant: Abe Sho , Shiono Daiju , Hirano Tomoyuki , Dazai Takahiro
- Applicant Address: JP Kanagawa-ken
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2008-176846 20080707
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/30 ; G03F7/38 ; C08F220/24 ; C08F222/18 ; C08F226/02
Abstract:
A negative resist composition including an alkali-soluble resin component (A), an acid generator component (B) that generates acid upon exposure, and a cross-linking component (C), the alkali-soluble resin component (A) including a polymeric compound (F) having a structural unit (f1) containing a base dissociable group and a structural unit (f2) containing a cross-linking group-containing group.
Public/Granted literature
- US20120164581A1 NEGATIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN AND POLYMERIC COMPOUND Public/Granted day:2012-06-28
Information query
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