Invention Grant
- Patent Title: Method for manufacturing stamper for injection molding
- Patent Title (中): 用于注塑成型压模的方法
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Application No.: US13394447Application Date: 2010-09-06
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Publication No.: US08771928B2Publication Date: 2014-07-08
- Inventor: Young Kyu Kim , Seok Jae Jeong
- Applicant: Young Kyu Kim , Seok Jae Jeong
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2009-0084953 20090909
- International Application: PCT/KR2010/006034 WO 20100906
- International Announcement: WO2011/031047 WO 20110317
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
The present invention relates to a method for manufacturing a stamper for injection molding, and more particularly, to a method for manufacturing a stamper for injection molding which can prevent a scratch from forming thereon and has an excellent durability owing to high hardness even after manufacturing of the metal stamper with micro patterns formed thereon is finished. The method for manufacturing a stamper for injection molding includes a pattern forming step for forming a predetermined micro pattern on a substrate, a metal plating step for making metal plating on the substrate to form a stamper having the micro pattern transcribed thereto, a stamper separating step for separating the stamper of the metal plating from the substrate, and a protective layer coating step for coating a protective layer on the stamper for maintaining a mirror surface.
Public/Granted literature
- US20120189962A1 METHOD FOR MANUFACTURING STAMPER FOR INJECTION MOLDING Public/Granted day:2012-07-26
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