Invention Grant
- Patent Title: Sealed chip package
- Patent Title (中): 密封芯片封装
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Application No.: US12939900Application Date: 2010-11-04
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Publication No.: US08772016B2Publication Date: 2014-07-08
- Inventor: Paul Newby , William R. Hanson , John Dixon , Bidhan Chaudhuri , Ravi Saxena
- Applicant: Paul Newby , William R. Hanson , John Dixon , Bidhan Chaudhuri , Ravi Saxena
- Applicant Address: US CA Menlo Park
- Assignee: Pacific Biosciences of California, Inc.
- Current Assignee: Pacific Biosciences of California, Inc.
- Current Assignee Address: US CA Menlo Park
- Agent Robert H. Reamey
- Main IPC: C12M1/34
- IPC: C12M1/34 ; B65D25/04 ; B65B43/00 ; B65B5/00 ; B32B3/24 ; H01L21/673
Abstract:
The invention provides environmental packages, instruments, and methods for sealing, protecting, and providing analysis chips for processing and analysis. The analysis chips are bonded directly or indirectly to chip carriers which are held within the chambers of an environmental packaging strip. The chambers are sealed with a sealing film such that the chip carriers can be extracted using a piercing tool and an extraction tool.
Public/Granted literature
- US20110183409A1 SEALED CHIP PACKAGE Public/Granted day:2011-07-28
Information query
