Invention Grant
- Patent Title: Housing body and method for production thereof
- Patent Title (中): 壳体及其制造方法
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Application No.: US13611890Application Date: 2012-09-12
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Publication No.: US08772065B2Publication Date: 2014-07-08
- Inventor: Georg Bogner , Karlheinz Arndt
- Applicant: Georg Bogner , Karlheinz Arndt
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cozen O'Connor
- Priority: DE102005024668 20050530
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
Public/Granted literature
- US20130005091A1 Housing Body and Method for Production thereof Public/Granted day:2013-01-03
Information query
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