Invention Grant
- Patent Title: Method and system for laser separation for exclusion region of multi-junction photovoltaic materials
- Patent Title (中): 多结光伏材料排除区激光分离方法与系统
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Application No.: US12389188Application Date: 2009-02-19
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Publication No.: US08772078B1Publication Date: 2014-07-08
- Inventor: Chester A. Farris, III
- Applicant: Chester A. Farris, III
- Applicant Address: US CA San Jose
- Assignee: Stion Corporation
- Current Assignee: Stion Corporation
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for laser separation of a thin film structure with multi junction photovoltaic materials. The method includes providing an optically transparent substrate having a thickness, a back surface region, and a front surface region including an edge region. The method further includes forming a thin film structure including a conductive layer on the optical transparent substrate. The conductive layer immediately overlies the front surface region. Additionally, the method includes aligning a laser beam with a beam spot on a first portion of the edge region from the back surface region through the thickness of the optically transparent substrate. The method further includes subjecting at least partially the conductive layer overlying the first portion via absorbed energy from the laser beam to separate an edge portion of the thin film structure from the first portion of the edge region.
Information query
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