Invention Grant
- Patent Title: Backside contacting on thin layer photovoltaic cells
- Patent Title (中): 在薄层光伏电池背面接触
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Application No.: US12594146Application Date: 2008-04-08
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Publication No.: US08772079B2Publication Date: 2014-07-08
- Inventor: Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
- Applicant: Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: IP Authority, LLC
- Agent Ramraj Soundararajan; William C. McBeth
- Priority: EP07108814 20070524
- International Application: PCT/EP2008/054205 WO 20080408
- International Announcement: WO2008/141863 WO 20081127
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0224

Abstract:
A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.
Public/Granted literature
- US20100132760A1 BACKSIDE CONTACTING ON THIN LAYER PHOTOVOLTAIC CELLS Public/Granted day:2010-06-03
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