Invention Grant
- Patent Title: Solder mask with anchor structures
- Patent Title (中): 焊接面具与锚结构
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Application No.: US13229687Application Date: 2011-09-10
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Publication No.: US08772083B2Publication Date: 2014-07-08
- Inventor: Andrew K W Leung , Roden R. Topacio , Yu-Ling Hsieh , Yip Seng Low
- Applicant: Andrew K W Leung , Roden R. Topacio , Yu-Ling Hsieh , Yip Seng Low
- Applicant Address: CA Markham US CA Sunnyvale
- Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee Address: CA Markham US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/31
Abstract:
Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.
Public/Granted literature
- US20130062786A1 SOLDER MASK WITH ANCHOR STRUCTURES Public/Granted day:2013-03-14
Information query
IPC分类:
